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Journal of Electronic Packaging
Volume: Page/CID:

Papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic, optoelectronic, and photonic components, devices, and systems.


Current Issue

December 2009

 

All Online Issues

March 1989  – December 2009

 

Journal of Electronic Packaging Cover

Editor:

Bahgat Sammakia
State University of New York at Binghamton


ISSN: 1043-7398

eISSN: 1528-9044

CODEN: JEPAE4


Frequency:

Quarterly

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